If you are finding a custom plastic blister packaging solution for RAM Memory Module. It is important to consider the protection of the delicate electronic components from potential electrostatic discharge (ESD) damage. Therefore, ESD antistatic plastics are commonly used for this purpose. Two common materials used for ESD antistatic plastic blister packaging are PS (polystyrene) and PET (polyethylene terephthalate).

Using vacuum forming technique is a fast and low-cost way to create a custom plastic blister packaging that meets your specific requirements for RAM memory module packaging. We can help you choose the most suitable material, design the packaging for optimal protection and presentation.